AUTOMATED PROCESS FOR CODESIGN OF RADIATION HARDENING AND SECURITY
SBIR Opportunity Analysis
DARPA, through the Department of War SBIR program, is seeking proposals to develop manufacturable mixed-signal integrated circuit technology for reliable operation in extreme thermal environments, while the listing frames the effort as automated co-design of radiation hardening and security for microelectronics. The work centers on advancing wide-bandgap-based designs and fabrication approaches, with Phase I focused on feasibility through modeling, simulation, and experimental validation, and Phase II aimed at a representative prototype. Key technical emphasis includes stable operation up to 800°C, demonstration of an amplifier and ring oscillator in Phase I, and a Phase II ADC while maturing the wafer fabrication process and process-design kit. The opportunity is open under SBIR topic DPA26BZ02-NV009, and proposals are due June 24, 2026 at 4:00 PM UTC.