AUTOMATED PROCESS FOR CODESIGN OF RADIATION HARDENING AND SECURITY

DARPA and the Department of War are soliciting proposals for the Small Business Innovation Research (SBIR) opportunity DPA26BZ02-NV009, focused on developing manufacturable mixed-signal integrated circuit (IC) technology capable of reliable operation at temperatures up to 800°C. This initiative addresses the limitations of current silicon-based technologies in extreme thermal environments, which are critical for defense, aerospace, and energy applications like missile guidance, geothermal monitoring, and space missions. The project aims to advance wide-bandgap materials like silicon carbide (SiC) and gallium nitride (GaN) to achieve high-speed, stable, and manufacturable ICs for sustained operation in harsh conditions. Phase I, a 6-month effort, focuses on demonstrating the feasibility of mixed-signal IC design and fabrication through modeling and simulation, with experimental validation of an amplifier and ring oscillator at 800°C. Phase II, anticipated for up to 36 months, will involve demonstrating an Analog-to-Digital Converter (ADC) capable of stable operation at 800°C with specific performance metrics and maturing the wafer fabrication process. Phase III will focus on commercializing the product for military and private sector markets, assessing and improving operating lifetime, and finalizing a Process-Design Kit (PDK) for standardized fabrication.