Spreaders for Microsystems with Advanced Thermal Resilience (SMART)
SBIR Opportunity Analysis
The Defense Advanced Research Projects Agency is soliciting innovative research and development proposals under the Spreaders for Microsystems with Advanced Thermal Resilience program to develop passive, thin-film heat spreader technologies. Awardees must design, fabricate, and demonstrate scalable, electrically insulating heat spreaders that achieve high thermal conductivity greater than 1500 W/m·K and low thermal boundary resistance without relying on active cooling. Key technical requirements include a low deposition temperature under 450 degrees Celsius for compatibility with diverse microsystems and performance survivability up to 800 degrees Celsius for extreme-temperature electronics. The procurement is structured as a dual-phase SBIR effort consisting of a six-month Phase I feasibility study followed by a thirty-six-month Phase II development and demonstration period. Proposals must be submitted by the application deadline of June 24, 2026, under solicitation number 26.BZ.