Division of Materials Research: Topical Materials Research Programs: Ceramics (CER), Electronic and Photonic Materials (EPM), Solid State and Materials Chemistry (SSMC)
Grant Opportunity Analysis
The U.S. National Science Foundation (NSF) is offering a federal grant opportunity through its Division of Materials Research, specifically targeting Topical Materials Research Programs in Ceramics (CER), Electronic and Photonic Materials (EPM), and Solid State and Materials Chemistry (SSMC). This grant aims to advance fundamental understanding and research in materials science, focusing on the discovery, design, synthesis, and characterization of materials, which are crucial for developing future technologies and industries. The estimated total program funding is $28 million, with proposals accepted on a rolling basis, and interested applicants can reach out to NSF grants.gov support at grantsgovsupport@nsf.gov for assistance. For more details, refer to NSF Publication 20-588 available at the provided link.
Eligible Applicants
*Who May Submit Proposals: Proposals may only be submitted by the following: -Non-profit, non-academic organizations: Independent museums, observatories, research laboratories, professional societies and similar organizations located in the U.S. that are directly associated with educational or research activities. -Institutions of Higher Education (IHEs): Two- and four-year IHEs (including community colleges) accredited in, and having a campus located in the US, acting on behalf of their faculty members. Special Instructions for International Branch Campuses of US IHEs: If the proposal includes funding to be provided to an international branch campus of a US institution of higher education (including through use of sub-awards and consultant arrangements), the proposer must explain the benefit(s) to the project of performance at the international branch campus, and justify why the project activities cannot be performed at the US campus. *Who May Serve as PI: See "Limit on Number of Proposals per PI or Co-PI" below.