Call For Solutions: Circuit Card Assembly (CCA) Production Support and Scalability Solutions

This Call for Solutions (Project CCA_26_01), issued by the Army Contracting Command – Aberdeen Proving Ground, Tobyhanna Division (TYAD), seeks innovative commercial methodologies, processes, and technologies to rapidly scale Circuit Card Assembly (CCA) production. Under Army Open Solicitation W9128Z-25-S-A002, the government aims to close internal capability gaps using existing Surface Mount Technology and through-hole machinery. Key solution requirements include advanced commercial engineering for reverse engineering and design, rapid technical data package generation, and proactive obsolescence management. Desired attributes include supply chain resilience and manufacturing efficiency upgrades, while traditional labor, standard production, and closed proprietary ecosystems are excluded. The evaluation process consists of three phases: a Phase 1 Solution Brief (due August 10, 2026), an optional Phase 2 Pitch, and a Phase 3 Solution Proposal. To pass initial administrative gates, offerors must agree to grant the government robust licensing and data rights, reject upfront retainer or standby fees in favor of a fee-for-service model, and demonstrate Cybersecurity Maturity Model Certification (CMMC) Level 2 readiness. Compliant submissions will be evaluated based on technical merit and innovation, operational agility and schedule, and commercial viability and cost realism. This solicitation may result in FAR-based contracts or non-FAR agreements, such as Other Transaction Agreements. Offerors must also submit an Organizational Conflict of Interest analysis alongside their brief.