Sources Sought Low Temp Anodic Bonding Glass Wafers
Contract Opportunity Analysis
The National Institute of Standards and Technology, within the Department of Commerce, is conducting a sources sought notice to identify vendors that can provide low-temperature anodic bonding glass wafers for market research and potential future acquisition. The requirement is for 10 to 50 polished 4-inch wafers with specifications that support anodic bonding below 250°C and a thermal expansion coefficient matched to silicon within 20 ppm from 0 to 450°C. The work is centered in Boulder, Colorado, and NIST is seeking responses from all responsible sources while using the results to determine whether a small business set-aside is appropriate, with manufacturing origin identified as part of the response. Interested firms should submit an electronic capability statement of four pages or less to Lisa Stevens at lisa.stevens@nist.gov; no quotes are being accepted at this stage.