The Defense Microelectronics Activity (DMEA) is re-soliciting proposals to establish Blanket Purchase Agreements (BPAs) for Printed Circuit Board (PCB) Fabrication and Assembly, including Circuit Card Assemblies (CCAs). This 100% small business set-aside, under NAICS 334418, operates under FAR Part 13 Simplified Acquisition Procedures. Proposals are due by December 15, 2025, at 12:00 PM Pacific time to Ryan Tung at ryan.c.tung.civ@mail.mil. The BPA has a maximum ceiling of $1,500,000.00 and expires on December 31, 2030. The government will place orders against these BPAs, with individual orders having no maximum size beyond the remaining BPA ceiling and a minimum of $15,000.00. Quotes will be solicited from BPA holders, with evaluation criteria considering price, technical capabilities, and past performance. Various FAR and DFARS provisions and clauses are applicable to this solicitation.

The Defense Microelectronics Activity (DMEA) is issuing a Request for Proposal (RFP) for Printed Circuit Board (PCB) Fabrication and Assembly Blanket Purchase Agreements (BPAs). This is a combined synopsis/solicitation for commercial items, seeking to establish a pool of BPAs with qualified offerors. The acquisition is a 100% small business set-aside, conducted under FAR Part 13 Simplified Acquisition Procedures. Selected offerors will have opportunities to submit quotes for specific PCB requirements throughout the ordering period. Proposals are due by 2:00 PM (Pacific) on Monday, August 18, 2025, via email to Ryan Tung, the sole point of contact for this acquisition. Attachments include the Performance Work Statement (PWS) 25-5E3, a draft BPA Agreement, and proposal instructions with evaluation criteria.

The Defense Microelectronics Activity (DMEA) has issued a combined synopsis/solicitation (RFP PWS 25-5E3) for establishing Blanket Purchase Agreements (BPAs) for Printed Circuit Board (PCB) Fabrication and Assembly. This acquisition is a 100% small business set-aside under FAR Part 13 Simplified Acquisition Procedures, with DMEA intending to award multiple BPAs competitively. Proposals are due via email to Contract Specialist Ryan Tung (ryan.c.tung.civ@mail.mil) by 2:00 PM (Pacific) on Friday, August 15, 2025. The solicitation includes various FAR and DFARS provisions and clauses applicable to the resulting contracts, covering areas such as System for Award Management, commercial item terms, and specific requirements for DoD procurements. Key attachments include the Performance Work Statement (PWS 25-5E3), a draft BPA agreement, and proposal instructions with evaluation criteria. Ryan Tung is the sole point of contact for all inquiries.

The Defense Microelectronics Activity (DMEA) is issuing a Request for Proposal (RFP) for Blanket Purchase Agreements (BPAs) related to Printed Circuit Board (PCB) fabrication and assembly. The RFP, identified as PWS 25-5E3, seeks to create a competitive pool of small businesses to fulfill PCB requirements as outlined in the attached Performance Work Statement. Offerors will be invited to submit pricing quotes for specific PCB tasks over the BPA's contract duration. This solicitation is designed to adhere to Simplified Acquisition Procedures, specifically set aside for small businesses. Proposals are due by 2:00 PM Pacific Time on August 15, 2025, and must be submitted via email to the designated Contract Specialist, Ryan Tung. The document details various Federal Acquisition Regulation (FAR) clauses applicable to the contract, emphasizing conditions around small business participation, compliance obligations, and procurement procedures. The DMEA envisions this acquisition as an opportunity to bolster microelectronic support for defense activities, ensuring quality and responsiveness in PCB production.

This Blanket Purchase Agreement (BPA) outlines the terms for the Defense Microelectronics Activity (DMEA) to acquire Printed Circuit Board (PCB) Fabrication and Assembly capabilities, including Circuit Card Assemblies (CCAs). The BPA, authorized under FAR 13.303, has an expiration date of August 31, 2030, or when a maximum ceiling of $7.5 million (divided by the number of qualified offerors) is reached, whichever comes first. It is not a contract and can be canceled with 30 days' notice for unsatisfactory performance. This is a multiple-award BPA, ensuring fair opportunity for multiple vendors due to the anticipated volume of requirements exceeding a single vendor's capacity. Individual order limits are $1,250,000, while the minimum order is $10,000. Only DMEA Contracting Officers are authorized to place orders, which are generally made via written orders. Ordering procedures involve competitive or single-BPA holder RFQs, with pricing based on the most favored customer. Default evaluation criteria for orders prioritize price, technical capability, and past performance. Follow-on orders may be issued to maintain production efficiency and minimize non-recurring engineering costs. All services must commence within 15 days of order receipt, and quality yield expectations are set at XX% or better. Invoices must be submitted electronically via Wide Area Workflow (WAWF) and include specific delivery ticket information.

The Blanket Purchase Agreement (BPA) established by the Defense Microelectronics Activity (DMEA) allows for the provision of Printed Circuit Board (PCB) Fabrication and Assembly services. The BPA is structured to limit government liability solely to the extent of orders placed by authorized personnel, ensuring fair opportunity among multiple awardees. The BPA has a ceiling of $7.5 million, expiring on August 31, 2030, or when the monetary limit is reached. Orders can be placed by DMEA's Contracting Officers and are limited to a minimum of $10,000 and a maximum of $1,250,000 per order. The BPA obligates vendors to provide competitive pricing, deliver products in a timely manner, and adhere to quality standards. It outlines procedures for issuing orders, including request for quotes (RFQs), evaluation criteria emphasizing price, technical capability, and past performance. The document underscores compliance with the Federal Acquisition Regulation (FAR) and highlights the importance of following specified guidelines for successful order fulfillment. Additionally, the BPA facilitates efficient production by allowing for follow-on orders and modifications, ensuring sustainable supply chain practices within the government procurement framework.

This government solicitation outlines instructions and evaluation criteria for Blanket Purchase Agreement (BPA) agreements for Printed Circuit Board Assembly (PCBA) and Fabrication (PCBF) services. Offerors must be SAM registered, and proposals should be submitted in Microsoft Office or PDF formats. The government will issue multiple BPA agreements without discussions, emphasizing the importance of accurate and complete initial submissions. Proposals will be evaluated on two main factors: Technical Capability (Factor 1) and Past Performance (Factor 2). Factor 1 assesses in-house PCB Assembly and Fabrication capabilities, a wide range of PCB fabrication and assembly activities, quality control processes, and component procurement. Offerors should explicitly state any ITAR or Trusted capabilities, though these are not mandatory. Factor 2 evaluates recent and relevant past performance, with greater weight given to experience in both PCBA and PCBF. The government will assess past performance relevance and assign a confidence assessment. Pricing information is not required at this stage; specific pricing will be determined for individual orders. The primary goal is to establish a pool of qualified suppliers capable of providing rapid PCBA units.

The Defense Microelectronics Activity (DMEA) is seeking proposals for a Printed Circuit Board (PCB) Fabrication and Assembly Blanket Purchase Agreement (BPA). This re-solicitation, HQ072725QRT04, outlines a two-phase evaluation process. Offerors must be SAM registered and submit technical and past performance volumes by December 15, 2025. Administratively qualified offerors will then receive Technical Data Packages (TDPs) for pricing. The evaluation prioritizes technical capability (Factor 1), followed by past performance (Factor 2), and finally pricing and TDP understanding (Factor 3). The government intends to make multiple BPA awards, up to a maximum of six, without discussions, and reserves the right to cancel the solicitation. Proposals should address in-house capabilities, quality control, technical specifications for fabrication and assembly, component procurement, and relevant past performance references. Pricing must detail unit costs for two TDPs,

The document outlines the proposal instructions and evaluation criteria for a government solicitation regarding PCB Assembly and Fabrication services. Key requirements for offerors include registration in the System for Award Management, submission format in Microsoft Office or PDF, and the inclusion of a proprietary data legend if necessary. Proposals will be evaluated based on two main factors: Technical Capability and Past Performance. Factor 1 focuses on the technical volume, requiring details on the offeror’s in-house capabilities for PCB fabrication and assembly, along with their quality control processes. Specific capabilities sought include the ability to handle complex PCB activities and component procurement. Factor 2 assesses past performance on similar projects within the last three years, considering relevance and providing points of contact for verification. The evaluation will result in multiple Blanket Purchase Agreements (BPAs) awarded to those who meet the government's requirements. The government emphasizes that proposals should not assume a chance for discussions or clarifications post-submission. The overall aim is to establish qualified suppliers to expedite the procurement of PCB assemblies while ensuring compliance and quality control.

This government file outlines the detailed requirements for contractors involved in PCB fabrication, component procurement, and PCB assembly, likely for federal government RFPs. Key requirements for PCB fabrication include adherence to IPC Class 3 standards (if not otherwise specified), provision of technical reports on electrical continuity and impedance tests, and DMEA approval for any subcontractors. For component procurement, contractors must source materials from authorized distributors or OEMs, with DMEA approval for alternative sources, and manage inventory efficiently to minimize lead times. PCB assembly mandates compliance with J-STD-001 and IPC-A-610 Class 2 requirements, use of Tin-Lead solder unless specified, and DMEA approval for assembly subcontractors. The document also specifies data item deliverables, including technical reports for PCB electrical tests, impedance tests, and fabrication/assembly inspections, all requiring specific distribution statements and submission prior to the end of the performance period.

The document outlines requirements for contractors in producing printed circuit boards (PCBs), procuring components, and assembling PCBAs (Printed Circuit Board Assemblies) for the Defense Microelectronics Activity (DMEA). Contractors must adhere to established fabrication and assembly standards, such as IPC-A-600 and J-STD-001 classifications, and provide necessary technical reports documenting testing and quality control. They maintain control over panelization strategies and component procurement, with restrictions on alternate sources unless approved by DMEA. Upon project completion, contractors are obligated to return excess materials to DMEA. The requirements also include specific reporting formats for technical test results, ensuring compliance with distribution protocols. This procurement initiative emphasizes adherence to quality standards, timely execution, and careful inventory management, crucial for supporting defense technology initiatives. This reflective document serves as a critical guide for contractors engaged in government-related electronics manufacturing projects, particularly in maintaining high standards of quality and operational compliance.