The Department of Commerce's National Institute of Standards and Technology (NIST) is seeking vendors to provide high-quality thin films on silicon wafers as part of its CHIPS Metrology program, which aims to enhance semiconductor manufacturing capabilities. The procurement specifically targets four classes of wafers: HfO2, TiN, ZrO2, and SiN, each with defined substrate and thickness parameters, along with customizable options for orders. These materials are crucial for advancing measurement techniques in semiconductor technology, and vendors are required to submit detailed responses that include company information, equipment specifications, and pricing transparency. Interested parties should direct inquiries to Elizabeth Timberlake at elizabeth.timberlake@nist.gov and submit their responses by the specified deadline, noting that this notice is a market research tool and not a commitment for contract awards.